04 · 04

The validator reports deterministic errors and advisory warnings. It scans every output line for configured geographic or regional terms, rejects visible market/language grouping, and validates component-attached company clauses. It cannot prove listing status or market precedence from bare names; verify those facts from primary sources. When editing this skill itself, run `python3 scripts/lint_skill.py` and `python3 -m unittest discover -s tests -v` from the skill directory.

Output Format

Return:

1. A short assumptions line when any product internals, style, or author credit were inferred.
2. One final prompt in a fenced code block, ready to paste into an image-generation model.
3. Optional prompt variants only when the user asks for alternatives.
4. For Chinese posters, include a `发布文案` section by default unless the user asks for prompt-only output or no social copy. The section must include 30 title candidates, mark one as recommended, include a separate `互动提问` section, and append the full source disclaimer directly to every individual platform version.
5. Every `互动提问` section must contain exactly 10 questions. Do not increase or decrease the count for a comment pack or any other mode.
6. When company recommendations are relevant, append bare names directly to the corresponding numbered component annotations.
7. A short "not generated" note when helpful: state that no image was created or inspected.

Company Name Recommendations

Only output bare company names.

- Select names relevant to the depicted product, component, process, or industry-chain role.
- Attach company names to the corresponding numbered component annotation.
- Internal precedence: A-share-related companies, then Hong Kong-listed companies, then other publicly traded companies.
- Apply the precedence independently within each component. A dual-listed company with an A-share relationship takes the first class; otherwise use the second or third class. Exclude unlisted companies.
- Never expose or label the market precedence.
- Use identical typography, font size, color, spacing, and separators for every company name.
- Do not translate, transliterate, regroup, or restyle names to signal categories.
- Do not create a standalone company panel, list, legend, footer, side column, or detached callout.
- After `相关公司：`, use `、` as the only separator and include no bullets, numbering, subheadings, brackets, classifications, or explanations.
- Omit any name containing a term from `references/geographic-terms.txt` or an identifiable country, territory, province, state, city, prefecture, county, district, or other place name.
- Do not shorten or alter a company name to remove a prohibited geographic term.
- Do not append a company introduction, product, business, location, ranking, reason, URL, stock code, or other metadata.
- Never output geographic or regional names.
- Never output company logos, logo-like marks, icons, or brand identity elements.

Use this exact machine-checkable form inside each relevant numbered component line. Replace the bracketed values with verified content:

text
01 "[component]" - [visual description] | 相关公司：[name]、[name]、[name]

Aspect Ratio Rules

- Every poster prompt must use an exact `3:4` portrait aspect ratio.
- Do not permit `2:3`, `4:5`, `9:16`, landscape, square, or any other ratio.
- Keep all content inside a safe area with approximately `5%` margin on every side so titles, labels, callouts, author credit, and source disclaimer do not touch or cross the canvas edge.
- Begin every final prompt and every prompt variant with the four mandatory lines below, verbatim and before any other prompt text:

text
画布比例必须为 3:4 竖版（Portrait 3:4）。
不允许生成 2:3、4:5、9:16 或其他比例。
所有内容需完整落在安全区域内，�
exec
/bin/zsh -lc "sed -n '221,520p' /Users/alex/.codex/skills/product-exploded-view-company-prompts/SKILL.md 2>&1 | head -c 12000" in /Users/alex/.openclaw/workspace/exploded-poster-gen
succeeded in 0ms:
- Keep it short, grounded, and educational; avoid launch-event tone, sales CTAs, exaggerated superlatives, and hard-marketing words.

In-image content density:
- Make the poster feel information-rich but still readable.
- Add optional secondary labels, tiny spec tags, compact annotation panels, thin connector notes, or small system-flow captions around the decomposition path.
- Use smaller text for secondary details and micro-annotations, while keeping the title, numbered layer names, main callouts, and author credit clearly readable.
- Keep a clear visual hierarchy; do not let dense text overlap parts, arrows, or callouts.

Top:
- Title: "[title]"
- Subtitle: "[one-sentence value proposition]"
- Small mark: "[product line or category]"

Author credit:
- Add visible in-image text inside the lower-middle content area, visually tied to the decomposition path, a callout cluster, or a small engineering annotation panel:
"[author/account credit]"
- Make it small, clean, readable, and integrated like a technical diagram note that belongs to the poster content.
- Do not place it at the very bottom edge, in a detachable footer strip, in a corner-only label, or as an isolated watermark.

Source disclaimer:
- Add visible small text near the author credit or inside the same lower-middle engineering annotation panel:
"声明：信息整理自网络公开内容，仅供学习交流；如有疏漏或错误，请联系指正。"
- Keep it readable but visually subordinate to component labels and main callouts.
- Do not place it on the bottom edge, hide it in metadata, or let it cover the product, numbered layers, arrows, or callouts.

Company-name treatment:
- Attach names only to their corresponding numbered component line.
- Use identical typography, font size, color, spacing, and separators for every company name.
- Preserve the supplied name order without adding classifications, group labels, translation, transliteration, columns, or detached panels.

Selected layout block:
[Insert only the instructions from the selected preset. Do not include either unused preset and do not ask the image model to choose.]

Numbered layers:
01 "[component]" - [visual description] | 相关公司：[name]、[name]、[name]
02 "[component]" - [visual description] | 相关公司：[name]、[name]、[name]
...

Callouts:
Left side:
"[heading]\n[short explanatory sentence]"
Right side:
"[heading]\n[short explanatory sentence]"

Bottom:
- Headline: "[bottom headline]"
- Body: "[2-3 concise sentences]"
- Footer mark: "[category / use case]"

Avoid:
garbled text, wrong language, Japanese text in Chinese posters, obvious brand logos, official logo glyphs, logo-like marks, company icons, company introductions, company products, company locations, company links, stock codes, rankings, recommendation reasons, geographic or regional names, origin-group labels, hard-ad title, sales CTA, exaggerated superlatives, hype words such as 重磅/颠覆/神器/必看/最强/炸裂/王炸, missing author credit, missing source disclaimer, metadata-only credit or disclaimer, watermark treatment, decorative clutter, empty-looking layout, unreadable tiny text, cropped labels, overlapping microtext, overlapping callouts, isolated floating parts without whole-to-parts guidance, unsupported exact claims about proprietary internals.

Component Rules

- Label every layer with a visible number and a short component name.
- Prefer 7-10 layers. Fewer can feel shallow; more often becomes unreadable.
- Group tiny internals into meaningful systems: compute, memory, power, cooling, frame, connector, enclosure, sensor, optics, battery, interface.
- Use callouts to explain function, not repeat component names.
- Keep primary image-model text short. Prefer one heading and one short sentence per main callout.
- Use "示意", "结构概念", "conceptual", or "schematic" for uncertain internals.
- For architecture or chips, describe whole package, stacked layers, key interconnect, base/control layer, package/interposer, and what the structure enables.
- For consumer products, describe shell/enclosure, display/interface, compute/control board, battery/power, sensors, connectors, thermal path, frame, and fastening when relevant.

In-Image Density Rules

- Use richer in-image text as an optional enhancement for technical posters when it helps the image feel complete and educational.
- Add 4-8 secondary details such as micro labels, small spec chips, short system-flow captions, mini legends, material notes, or compact annotation panels.
- Use smaller typography for secondary details, but do not make any required label, number, author credit, source disclaimer, or main callout tiny.
- Richer text should support the visual reading path, not become decorative filler.
- Avoid dense paragraphs inside the image; prefer short fragments, labels, and one-line notes.

Title Rules

- Poster titles should feel like technical editorial hooks, not product ads.
- Prefer titles that reveal a question, contrast, or structural role, such as "GPU 背后的调度底座", "为什么它不是显卡", or "AI 工厂里被低估的 CPU".
- Avoid hard-marketing title patterns such as "重磅发布", "颠覆未来", "最强芯片", "必看神器", "王炸新品", and sales-style calls to action.
- Keep the title shorter than the subtitle; let the subtitle carry the precise product name or use case when the title is more editorial.
- For Chinese publishing copy, generate 30 distinct title candidates by default and mark one recommended title.

Author Credit Rules

- Every prompt must include an in-image author/account credit.
- For Chinese content, use `作者：{name}`.
- Default to `作者：好用工具推荐` when no conflicting account appears.
- Place the credit inside the lower-middle content area, beside the lower decomposition axis, next to a real callout group, or inside a small engineering annotation panel connected to the diagram.
- Make the credit feel naturally merged with the real content so it is not easy to remove by cropping the bottom or deleting a detached footer.
- Avoid the very bottom edge, detached footer strips, corner-only labels, and large watermark treatment. Also avoid placing it too high or over the main reading path.
- Keep the credit smaller than component labels but clearly readable.
- Do not let it cover the product, numbered layers, arrows, or callouts.
- Do not treat the credit as a watermark outside the design; integrate it as a technical poster annotation.
- Do not use placeholders such as `【作者名】`, `{author}`, `[account]`, or `{name}` in the final prompt.

Source Disclaimer Rules

- Every Chinese technical poster prompt and companion publishing copy must include a source disclaimer.
- Default wording: `声明：信息整理自网络公开内容，仅供学习交流；如有疏漏或错误，请联系指正。`
- If the user supplies different wording, preserve it unless it creates a factual or legal misrepresentation.
- Require the disclaimer as visible image text near the author credit or in a connected lower-middle technical annotation panel. Keep it smaller than primary labels but clearly readable.
- Do not place it at the bottom edge, in a detachable footer, only in metadata, or outside the image.
- Append the full disclaimer directly at the end of every publish-ready platform version, including 作者, 小红书, 朋友圈/社群, and 知乎/B站动态.
- Do not consolidate, deduplicate, or replace these per-platform endings with a shared disclaimer, reusable ending, "通用结尾", footnote, or instruction to add it later.
- Do not claim that the generated image contains or correctly renders the disclaimer because this skill does not generate or inspect images.
- The disclaimer does not replace source verification. Continue to use official or primary sources when accuracy matters and label uncertain internals as conceptual or schematic.

Chinese Social Copy

Include social-media publishing copy by default for Chinese poster prompts unless the user asks for prompt-only output or no social copy. Use:

- 30 distinct title candidates by default, with one clearly marked as the recommended title; each title must be 15–20 visible characters (count Chinese characters, letters, digits, punctuation — every visible glyph counts). Titles shorter than 15 or longer than 20 visible characters are invalid and must be rewritten.
- A concise body that starts from the visual reading path, for example "通过这张图可以看到...".
- A mandatory separate `互动提问` section after the title candidates and before the platform rewrites.
- Every `互动提问` section must contain exactly 10 questions.
- Ask only knowledge- and content-related questions about the current subject.
- Focus on structure, component function, architecture, process, trade-offs, bottlenecks, applications, limitations, reliability, cost, efficiency, or technical comparisons.
- Phrase every item as a genuine question ending in `？` or `?`, for example asking what function a component performs, where a bottleneck occurs, why a material was selected, or what trade-off an architecture makes.
- Every question must explicitly include the topic keyword (the subject of the poster, e.g. NVLink, B200, CoWoS) in the question text. Do not use generic references like "this architecture", "this component", or "this design" as a substitute for the keyword.
- Do not ask what topic, product, teardown, article, image, or subject the audience wants next.
- Do not ask subjective-preference or opinion questions. Reject phrasing such as "你觉得", "你认为", "哪个更", "会更", "会不会", "值不值得", "有没有必要", or any question that asks the reader to pick a favorite, predict adoption, or express personal taste. Every question must have a verifiable technical answer grounded in the subject's structure, process, physics, or engineering constraints.
- Do not use generic engagement bait without a concrete technical object or trade-off.
- Reject prompts such as asking what to cover next, what else the reader wants to see, or requesting future-topic suggestions in comments.
- Do not write analytical evaluation paragraphs, generic praise, rhetorical promotion, predetermined conclusions, or unrelated engagement bait.
- Default platform rewrites for 作者, 小红书, 朋友圈/社群, and 知乎/B站动态.
- Append `声明：信息整理自网络公开内容，仅供学习交流；如有疏漏或错误，请联系指正。` in full directly after the content of each platform rewrite.
- Repeat the disclaimer for every platform even when the wording is identical. Never use one shared "通用结尾", reusable ending, or cross-reference in place of the repeated text.
- Keep platform rewrites concise, distinct, and non-promotional; avoid hype words, sales CTAs, and exaggerated claims.
- A request for comments or a full comment pack still receives exactly 10 knowledge-focused questions.
- For architecture diagrams, keep the body concrete: whole package, stacked layers, key interconnect, base/control layer, package/interposer, and what the structure enables.

Text-Risk Note

- Include a short risk note for prompt-only Chinese poster tasks when useful.
- Flag only obvious platform-risk terms: politics, sexual/adult content, graphic violence, gambling, drugs, hate/extremism, illegal activity, and similar categories.
- Treat technical false positives in context. `爆炸图/爆炸展开` are exploded-view terms; `安全隔离` is a security/networking term; `确定性` is a performance/architecture term.
- Do not claim visible image text has been inspected, because this prompt-only skill does not generate or verify images.

web search:
web search: 精测电子 半导体量测 公开上市 官方 投资者关系
web search:
web search: Onto Innovation metrology inspection NYSE official wafer metrology
codex
假设：按概念结构图处理，侧重前道晶圆量测/检测设备的共性模块，内部结构不指向某一具体机型。

text
画布比例必须为 3:4 竖版（Portrait 3:4）。
不允许生成 2:3、4:5、9:16 或其他比例。
所有内容需完整落在安全区域内，四边保留约 5% 留白。
竖版 3:4 中文技术拆解海报，现代无衬线字体，深色精密仪器风格，干净、克制、信息密度高。

主题：半导体晶圆量测设备概念爆炸图。
标题：半导体晶圆量测设备核心结构拆解
副标题：从进片、定位、成像、量测到数据判读，看懂良率控制背后的设备分层。
顶部小标：前道制程量测 / 缺陷检测 / 过程控制

画面构图：
中心放置一台中性外观的晶圆量测设备整机，左侧保留完整机台轮廓，右侧沿一条细长竖向分解轴展开内部模块。每层用细线连接到对应位置，形成“完整设备 -> 分解导向轴 -> 编号组件层”的阅读路径。零部件需有真实工程质感：金属框架、洁净腔体、光学镜组、运动平台、电控线束、散热与气路，但不要表现为某一真实机型。

视觉风格：
高精度半导体设备渲染，暗灰机身、银色金属、蓝白测量光束、局部透明剖切、细线工程标注。背景为低对比网格和洁净室感弱透视地面，避免装饰性杂乱元素。不要绘制官方 logo、glyph、商标图形、公司图标或任何非技术归属文字。

来源声明：
在画面下方偏中部的工程注释区加入小号清晰文字：
“声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正”
该声明需可读，但小于主标题、组件名和主标注；不要放在画布边缘，不要做成水印，不要覆盖设备、箭头或组件。

编号组件层：
01 "洁净外罩与隔振底座" - 半透明外壳、门禁互锁、抗振基座、水平调节脚，表现设备稳定测量环境 | 相关公司：中科飞测、精测电子、华兴源创
02 "晶圆装载与预对准模块" - FOUP 接口、传片机械臂、预对准台、边缘识别传感器，表现洁净传片路径 | 相关公司：Azenta、RORZE、Hirata
03 "纳米运动平台" - 花岗岩基座、气浮导轨、线性电机、编码反馈尺，表现高重复定位 | 相关公司：天准科技、奥普光电、MKS Instruments
04 "照明光源与光路整形" - 多波段光源、准直镜、分光器、偏振控制单元，表现稳定入射光束 | 相关公司：奥普光电、Hamamatsu、Coherent
05 "物镜塔与成像传感" - 高倍率物镜、自动调焦、CMOS 成像阵列、暗场/明场切换结构 | 相关公司：奥普光电、Camtek、Onto Innovation
06 "干涉与薄膜量测头" - 干涉光路、椭偏测量、膜厚拟合、OCD 采样窗口，表现纳米级轮廓量测 | 相关公司：精测电子、中科飞测、Nova
07 "电子束复核单元" - 真空小腔、电子光学柱、二次电子采集、低损伤复核路径，表现关键缺陷确认 | 相关公司：精测电子、中科飞测、KLA
08 "缺陷检测与三维形貌模块" - 宏观缺陷扫描、台阶高度、翘曲/应力示意、三维重建小窗 | 相关公司：中科飞测、Onto Innovation、Camtek
09 "控制计算与算法软件" - 工控机、GPU 加速卡、缺陷分类模型、SPC 数据流、良率分析界面 | 相关公司：华兴源创、KLA、Onto Innovation
10 "温控电源与气路系统" - 精密电源、冷却回路、气体过滤、压力监控、互锁保护，表现稳定运行保障 | 相关公司：MKS Instruments、Horiba、VAT Group

辅助标注：
左侧标注一：
“测量链路”
“光源、平台、传感器和算法共同决定量测稳定性。”

左侧标注二：
“误差来源”
“振动、温漂、对焦漂移和模型拟合都会影响最终数据。”

右侧标注一：
“良率闭环”
“量测结果回传制程参数，用于发现偏移和控制窗口。”

右侧标注二：
“多技术组合”
“光学、电子束、三维形貌和薄膜量测对应不同缺陷类型。”

底部说明：
标题：为什么它是晶圆厂的“尺子”
正文：晶圆量测设备不是单一相机，而是光机电、运动控制、算法和制程数据的组合系统。它把微小结构变化转化为可追踪的数据，帮助判断工艺是否偏离窗口。
底部小标：概念结构图 / 非具体机型 / 中文技术拆解

避免：
乱码、错别字、日文、英文大段文字、官方 logo、glyph、商标图形、公司图标、公司介绍、产品介绍、链接、股票代码、排名、推荐理由、销售口吻、夸张营销词、底部水印、边缘文字、裁切标签、重叠标注、过密小字、没有完整设备轮廓、没有分解导向轴、把概念结构画成确定的专有内部结构。

发布文案

推荐标题：半导体晶圆量测设备核心结构拆解

1. 半导体晶圆量测设备核心结构拆解（推荐）
2. 晶圆量测设备如何读懂缺陷路径
3. 从光路看晶圆量测设备分层全貌
4. 晶圆量测设备里的纳米定位链路图
5. 一台晶圆量测设备的内部路径解析
6. 量测设备怎样守住晶圆良率边界线
7. 晶圆量测设备从进片到判读流程图
8. 光学量测设备的结构分工图与数据
9. 电子束量测单元如何复核缺陷细节
10. 晶圆量测设备的十层功能骨架全图
11. 薄膜量测头如何看清厚度变化路径
12. 晶圆缺陷检测的设备内核图拆解版
13. 从平台到算法看晶圆量测设备结构
14. 晶圆量测设备为何需要隔振系统支撑
15. 高精度量测设备的光机电链路解析
16. 晶圆量测设备怎样减少误差传播链
17. 量测设备里的光源与传感协同路径
18. 晶圆量测设备的洁净传片逻辑图解
19. 三维形貌量测如何服务工艺控制图
20. 半导体量测设备的模块分层拆解图
21. 晶圆量测设备里的数据闭环如何形成
22. 从晶圆进片看量测设备职责分工图
23. 量测设备如何支撑制程窗口管理图
24. 晶圆量测设备的误差来源地图解析
25. 光学检测与量测设备结构对照图谱
26. 晶圆量测设备的关键子系统完整展开
27. 量测设备如何把图像变数据流程图
28. 晶圆量测中的运动平台拆解解析图
29. 薄膜厚度量测设备内部逻辑拆解图
30. 晶圆量测设备从光到数解析全链路

互动提问

1. 半导体晶圆量测设备中的隔振底座主要降低哪类测量误差？
2. 半导体晶圆量测设备为什么需要预对准模块参与进片流程？
3. 半导体晶圆量测设备的纳米运动平台如何影响重复定位精度？
4. 半导体晶圆量测设备中明场和暗场成像分别适合识别哪些缺陷？
5. 半导体晶圆量测设备的薄膜量测头如何把光谱变化转成厚度数据？
6. 半导体晶圆量测设备为什么会同时使用光学量测和电子束复核？
7. 半导体晶圆量测设备的温控系统会影响哪些关键测量参数？
8. 半导体晶圆量测设备中的算法软件如何完成缺陷分类和数据回传？
9. 半导体晶圆量测设备怎样把三维形貌数据用于制程窗口管理？
10. 半导体晶圆量测设备的主要误差链路通常从哪些子系统开始？

版本一：
通过这张图可以看到，半导体晶圆量测设备的核心不是单个镜头，而是一整套光机电系统：进片、预对准、纳米定位、光学成像、薄膜量测、缺陷复核、算法判读，再到制程数据回传。它像晶圆厂里的精密尺子，把看不见的微小偏移变成可追踪的数据。声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正

版本二：
一台晶圆量测设备，真正难的地方在稳定性。振动、温漂、对焦、光路、平台重复定位、模型拟合，任何一个环节都会影响最终读数。这张结构图把设备拆成十个模块，适合快速理解量测设备为什么能支撑良率闭环。声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正

版本三：
半导体制程越来越复杂，量测设备承担的是“发现偏差”的任务。它不只看缺陷，还要把厚度、线宽、形貌、应力、翘曲等信息转成数据，再反馈给工艺控制系统。图里把从晶圆进入设备到数据输出的路径串起来了。声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正

版本四：
看晶圆量测设备，可以抓住三条线：第一是机械线，保证晶圆稳定移动；第二是光学线，完成照明、成像和量测；第三是数据线，把图像、光谱和形貌转成工艺判断。这三条线合在一起，才形成真正的过程控制能力。声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正

风险提示：文中的“拆解”“展开”均为结构图语境；未涉及政治、成人、暴力、博彩、毒品、仇恨、违法等明显平台风险内容。未生成或检查图片。

公开资料参考：KLA wafer inspection/metrology 页面、Onto Innovation 官网、Nova 官网、Camtek 官网，以及精测电子、中科飞测公开披露资料。
tokens used
41,117
假设：按概念结构图处理，侧重前道晶圆量测/检测设备的共性模块，内部结构不指向某一具体机型。

text
画布比例必须为 3:4 竖版（Portrait 3:4）。
不允许生成 2:3、4:5、9:16 或其他比例。
所有内容需完整落在安全区域内，四边保留约 5% 留白。
竖版 3:4 中文技术拆解海报，现代无衬线字体，深色精密仪器风格，干净、克制、信息密度高。

主题：半导体晶圆量测设备概念爆炸图。
标题：半导体晶圆量测设备核心结构拆解
副标题：从进片、定位、成像、量测到数据判读，看懂良率控制背后的设备分层。
顶部小标：前道制程量测 / 缺陷检测 / 过程控制

画面构图：
中心放置一台中性外观的晶圆量测设备整机，左侧保留完整机台轮廓，右侧沿一条细长竖向分解轴展开内部模块。每层用细线连接到对应位置，形成“完整设备 -> 分解导向轴 -> 编号组件层”的阅读路径。零部件需有真实工程质感：金属框架、洁净腔体、光学镜组、运动平台、电控线束、散热与气路，但不要表现为某一真实机型。

视觉风格：
高精度半导体设备渲染，暗灰机身、银色金属、蓝白测量光束、局部透明剖切、细线工程标注。背景为低对比网格和洁净室感弱透视地面，避免装饰性杂乱元素。不要绘制官方 logo、glyph、商标图形、公司图标或任何非技术归属文字。

来源声明：
在画面下方偏中部的工程注释区加入小号清晰文字：
“声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正”
该声明需可读，但小于主标题、组件名和主标注；不要放在画布边缘，不要做成水印，不要覆盖设备、箭头或组件。

编号组件层：
01 "洁净外罩与隔振底座" - 半透明外壳、门禁互锁、抗振基座、水平调节脚，表现设备稳定测量环境 | 相关公司：中科飞测、精测电子、华兴源创
02 "晶圆装载与预对准模块" - FOUP 接口、传片机械臂、预对准台、边缘识别传感器，表现洁净传片路径 | 相关公司：Azenta、RORZE、Hirata
03 "纳米运动平台" - 花岗岩基座、气浮导轨、线性电机、编码反馈尺，表现高重复定位 | 相关公司：天准科技、奥普光电、MKS Instruments
04 "照明光源与光路整形" - 多波段光源、准直镜、分光器、偏振控制单元，表现稳定入射光束 | 相关公司：奥普光电、Hamamatsu、Coherent
05 "物镜塔与成像传感" - 高倍率物镜、自动调焦、CMOS 成像阵列、暗场/明场切换结构 | 相关公司：奥普光电、Camtek、Onto Innovation
06 "干涉与薄膜量测头" - 干涉光路、椭偏测量、膜厚拟合、OCD 采样窗口，表现纳米级轮廓量测 | 相关公司：精测电子、中科飞测、Nova
07 "电子束复核单元" - 真空小腔、电子光学柱、二次电子采集、低损伤复核路径，表现关键缺陷确认 | 相关公司：精测电子、中科飞测、KLA
08 "缺陷检测与三维形貌模块" - 宏观缺陷扫描、台阶高度、翘曲/应力示意、三维重建小窗 | 相关公司：中科飞测、Onto Innovation、Camtek
09 "控制计算与算法软件" - 工控机、GPU 加速卡、缺陷分类模型、SPC 数据流、良率分析界面 | 相关公司：华兴源创、KLA、Onto Innovation
10 "温控电源与气路系统" - 精密电源、冷却回路、气体过滤、压力监控、互锁保护，表现稳定运行保障 | 相关公司：MKS Instruments、Horiba、VAT Group

辅助标注：
左侧标注一：
“测量链路”
“光源、平台、传感器和算法共同决定量测稳定性。”

左侧标注二：
“误差来源”
“振动、温漂、对焦漂移和模型拟合都会影响最终数据。”

右侧标注一：
“良率闭环”
“量测结果回传制程参数，用于发现偏移和控制窗口。”

右侧标注二：
“多技术组合”
“光学、电子束、三维形貌和薄膜量测对应不同缺陷类型。”

底部说明：
标题：为什么它是晶圆厂的“尺子”
正文：晶圆量测设备不是单一相机，而是光机电、运动控制、算法和制程数据的组合系统。它把微小结构变化转化为可追踪的数据，帮助判断工艺是否偏离窗口。
底部小标：概念结构图 / 非具体机型 / 中文技术拆解

避免：
乱码、错别字、日文、英文大段文字、官方 logo、glyph、商标图形、公司图标、公司介绍、产品介绍、链接、股票代码、排名、推荐理由、销售口吻、夸张营销词、底部水印、边缘文字、裁切标签、重叠标注、过密小字、没有完整设备轮廓、没有分解导向轴、把概念结构画成确定的专有内部结构。

发布文案

推荐标题：半导体晶圆量测设备核心结构拆解

1. 半导体晶圆量测设备核心结构拆解（推荐）
2. 晶圆量测设备如何读懂缺陷路径
3. 从光路看晶圆量测设备分层全貌
4. 晶圆量测设备里的纳米定位链路图
5. 一台晶圆量测设备的内部路径解析
6. 量测设备怎样守住晶圆良率边界线
7. 晶圆量测设备从进片到判读流程图
8. 光学量测设备的结构分工图与数据
9. 电子束量测单元如何复核缺陷细节
10. 晶圆量测设备的十层功能骨架全图
11. 薄膜量测头如何看清厚度变化路径
12. 晶圆缺陷检测的设备内核图拆解版
13. 从平台到算法看晶圆量测设备结构
14. 晶圆量测设备为何需要隔振系统支撑
15. 高精度量测设备的光机电链路解析
16. 晶圆量测设备怎样减少误差传播链
17. 量测设备里的光源与传感协同路径
18. 晶圆量测设备的洁净传片逻辑图解
19. 三维形貌量测如何服务工艺控制图
20. 半导体量测设备的模块分层拆解图
21. 晶圆量测设备里的数据闭环如何形成
22. 从晶圆进片看量测设备职责分工图
23. 量测设备如何支撑制程窗口管理图
24. 晶圆量测设备的误差来源地图解析
25. 光学检测与量测设备结构对照图谱
26. 晶圆量测设备的关键子系统完整展开
27. 量测设备如何把图像变数据流程图
28. 晶圆量测中的运动平台拆解解析图
29. 薄膜厚度量测设备内部逻辑拆解图
30. 晶圆量测设备从光到数解析全链路

互动提问

1. 半导体晶圆量测设备中的隔振底座主要降低哪类测量误差？
2. 半导体晶圆量测设备为什么需要预对准模块参与进片流程？
3. 半导体晶圆量测设备的纳米运动平台如何影响重复定位精度？
4. 半导体晶圆量测设备中明场和暗场成像分别适合识别哪些缺陷？
5. 半导体晶圆量测设备的薄膜量测头如何把光谱变化转成厚度数据？
6. 半导体晶圆量测设备为什么会同时使用光学量测和电子束复核？
7. 半导体晶圆量测设备的温控系统会影响哪些关键测量参数？
8. 半导体晶圆量测设备中的算法软件如何完成缺陷分类和数据回传？
9. 半导体晶圆量测设备怎样把三维形貌数据用于制程窗口管理？
10. 半导体晶圆量测设备的主要误差链路通常从哪些子系统开始？

版本一：
通过这张图可以看到，半导体晶圆量测设备的核心不是单个镜头，而是一整套光机电系统：进片、预对准、纳米定位、光学成像、薄膜量测、缺陷复核、算法判读，再到制程数据回传。它像晶圆厂里的精密尺子，把看不见的微小偏移变成可追踪的数据。声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正

版本二：
一台晶圆量测设备，真正难的地方在稳定性。振动、温漂、对焦、光路、平台重复定位、模型拟合，任何一个环节都会影响最终读数。这张结构图把设备拆成十个模块，适合快速理解量测设备为什么能支撑良率闭环。声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正

版本三：
半导体制程越来越复杂，量测设备承担的是“发现偏差”的任务。它不只看缺陷，还要把厚度、线宽、形貌、应力、翘曲等信息转成数据，再反馈给工艺控制系统。图里把从晶圆进入设备到数据输出的路径串起来了。声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正

版本四：
看晶圆量测设备，可以抓住三条线：第一是机械线，保证晶圆稳定移动；第二是光学线，完成照明、成像和量测；第三是数据线，把图像、光谱和形貌转成工艺判断。这三条线合在一起，才形成真正的过程控制能力。声明:信息整理自网络公开内容,仅供学习交流;如有疏漏或错误,请联系指正

风险提示：文中的“拆解”“展开”均为结构图语境；未涉及政治、成人、暴力、博彩、毒品、仇恨、违法等明显平台风险内容。未生成或检查图片。

公开资料参考：KLA wafer inspection/metrology 页面、Onto Innovation 官网、Nova 官网、Camtek 官网，以及精测电子、中科飞测公开披露资料。